The WAVE Report
Issue #0134------------------7/26/01

The WAVE Report archive is available on


0134.1 Hot Topics

    Wink’s Broadcasting Service Reaches More Than One

      Million U.S. Cable Households

    Cambridge Animation Systems Ships Swiffworks for Maya


    Envara's WiND Wireless LAN Chipset Design Offers Dual-

      Mode Compatibility With Both IEEE 802.11a and b

0134.2 Story of the Issue

    Shareholder Sues Transmeta Corporation for Securities


    WAVE Comments

0134.3 Chips

    SEMI Announces Mid-Year Consensus Forecast for Chip

      Equipment Industry

0134.4   3D

    ARM and Superscape Announce Collaboration to Develop

      Interactive 3D Software On Wireless Devices


    Virtools Expands its Offer to E-Marketing, E-Learning

      and Games

0134.5 Information Appliances

    Motorola Announces Alliance with Palm

0134.6 Audio

    Pioneer's XM Satellite Tuners Available in September


    Toshiba Microcontroller with SD Memory Card Controller

0134.7 Standards

    Progress Made on IEEE 802.17 RPR Standard



0134.1 Hot Topics

***Wink’s Broadcasting Service Reaches More Than One Million U.S. Cable Households

(July 23)

Wink Communications has announced that the Company's Enhanced Broadcasting services reach more than one million cable homes – an increase of 5X from a year ago. North American cable subscribers in 44 cable systems are able to subscribe to the company’s broadcasting services - up from 17 systems the same time last year.

Wink is currently deployed in cable systems with Adelphia, AT&T Broadband, Charter, Comcast, and Time Warner Cable. The Wink service is included as a standard feature for all Charter, Adelphia and Comcast digital cable customers.

There are currently thirty-two networks partnered with Wink that are adding interactivity to their programming and advertisements. In total there are more than two thousand hours of programming each week are being enhanced with Wink's technology. More than six out of ten homes that have Wink are using it regularly and with some frequency.

***Cambridge Animation Systems Ships Swiffworks for Maya 4.0

(July 25)

Cambridge Animation Systems, maker of Animo software, has begun shipping Swiffworks for Maya 4.0, the latest version of its plug-in that delivers Macromedia Flash (.swf) output to users of Alias|Wavefront's Maya. As a special offer, Swiffworks is available until August 31 for $199, or $299 bundled with Inkworks, Cambridge's toonshader.

The plug-in allows users to choose a Swiffworks material or use the default Phong material provided by Maya. Swiffworks materials provide the following added capabilities:

· Independent control of ink lines and painted regions, allowing line thickness to be animated and colored separately from the painted areas

 Control over the color, width and generation of ink lines, including folds, silhouettes, region lines, borders and intersection lines

The Swiffworks renderer is fully integrated into Maya 4.0. Swiffworks will also be available on IRIX and Mac OS X later this year. Swiffworks normally sells for $575 or $800 in a bundle with Inkworks.

***Envara's WiND Wireless LAN Chipset Design Offers Dual-Mode Compatibility With Both IEEE 802.11a and b

(July 23)

Envara has announced that its WiND wireless chipset design, which will operate in the 5GHz band, will also offer compatibility with 2.4GHz, IEEE 802.11b (Wi-Fi) compliant wireless LAN devices. The WiND chipset will therefore offer the following advantages (enabled by 5GHz technology): higher data rates, larger network capacity and less interference.

Additional features included in the WiND chipset will include enhanced Media Access Control (MAC) features enabling:

  Security for complete data privacy (802.11i)

  Dynamic Frequency Selection (DFS) and Transmit Power Control (TPC) for worldwide radio regulation conformance and out-of-the-box installation (802.11h)

  QoS for users with streaming multimedia requirements (802.11e).

The WiND dual mode IEEE 802.11a+b chipset design is a 2 chip solution that includes an integrated baseband chip with built-in MAC and dual IEEE 802.11a+b modem functionality, and a low cost RF chip with an integrated dual band 2.4 and 5GHz implementation. The chipsets will begin sampling in 4Q2002, and will be available under $30 in quantities of 100K units and more. Single mode 5GHz chipsets will begin sampling in 2Q2002, and will be accompanied by reference designs for dual mode wireless LAN products.

For more information on IEEE Standards go to:

0134.2 Story of the Issue

***Shareholder Sues Transmeta Corporation for Securities Fraud

(July 23)

A shareholder has sued Transmeta claiming that the company misled investors about its main product, the law firm of Berman DeValerio Pease Tabacco Burt & Pucillo said. The lawsuit was filed in the United States District Court for the Northern District of California and is pending before Chief Magistrate Judge Patricia V. Trumbull. It seeks damages for violations of federal securities laws on behalf of all investors who bought Transmeta stock between November 7, 2000 and June 20, 2001 (the "Class Period").

The complaint accuses Transmeta and several of its top officers with issuing false and misleading statements about its principal product, the Crusoe line of microprocessors. According to the lawsuit, the defendants made false claims about the technology that enabled the Crusoe chips to consume less energy while delivering high performance to mobile Internet computers. The company made these claims in documents related to its November 7, 2000 initial public offering and throughout the Class Period.

The statements powered Transmeta stock to a high of $50.875 per share and enabled five of the defendants to sell 829,500 shares of their Transmeta stock for more than $10.5 million in May 2001. But only weeks after those sales took place, Transmeta said that its results for the second quarter of 2001 would be worse than projected and that it would be forced to take a multimillion-dollar inventory charge because of defective and outdated products.

After the company's announcement, Transmeta stock fell to $5.12 a share before closing at $5.36 a share, 89% off its Class Period high.

***WAVE Comments

In these times of depressed stock prices let the technology company beware of class action suits. Transmeta raised high levels of expectation about its performance and potential to challenge Intel. Yet, the true performance was carefully held back until systems were actually shipping, and the performance could be measured by independent 3rd parties. Now some of the shareholders are crying foul. Even in the best of times management is open to threats of suits when the stock tanks. Transmeta is going to have to explain its actions and ability to execute.

0134.3 Chips

***SEMI Announces Mid-Year Consensus Forecast for Chip Equipment Industry

(July 16)

Manufacturers of semiconductor equipment expect the industry to decline 35 percent from the $47.7 billion posted in 2000, according to the mid-year edition of the SEMI Capital Equipment Consensus Forecast, released by Semiconductor Equipment and Materials International (SEMI). Survey respondents anticipate the industry to ship $31 billion of chip manufacturing, testing and assembly equipment in 2001.

The forecast also indicates that the capital equipment market will grow 11.6 percent in 2002, to reach $34.6 billion; and 22.5 percent in 2003 to $42.4 billion.

The SEMI Consensus Forecast includes input from 71 of the trade association's member companies in the United States, Europe and Japan. The forecast results are based on data collected between May and June 2001 by the SEMI Industry Research and Statistic department. Responding companies represent more than 85 percent of the total sales volume for the global semiconductor equipment industry.

0134.4   3D

***ARM and Superscape Announce Collaboration to Develop Interactive 3D Software On Wireless Devices

(July 24)

ARM, a provider of 16/32-bit embedded RISC processor solutions, and Superscape, an interactive 3D company, announced that they are to collaborate on the development of interactive 3D (i3D) enabling technology for wireless devices. This relationship will enable a generation of multimedia for 2.5 and 3G mobile phones for applications including entertainment, information services, personalized navigation and messaging systems.

Under the terms of the agreement, Superscape will license their SWERVE i3D software engine to ARM.

Superscape specializes in small file sizes (for fast download) and visual quality. The company's i3D technology for wireless devices, is capable of delivering interactive services on both 2G and 2.5G networks, prior to the introduction of the 3G roll out. The new technology, which will provide an 'engine' and content authoring capabilities, has been designed to integrate with other development tools, such as Java technology, to encourage the proliferation of i3D content for wireless devices.

Learn more about i3D and Superscape’s products:

***Virtools Expands its Offer to E-Marketing, E-Learning and Games

(July 15)

Virtools, a provider of interactive 3D development solutions has announced the release of Virtools Dev 2.0, a solution that puts game industry capabilities to work for a range of markets. Virtools interactive 3D development solutions enable companies to deploy game-quality interactive 3D applications for e-Marketing, e-Learning and game creation while keeping costs under control and reducing the risk associated with developing interactive applications.

The Virtools Solution Package is comprised of both Virtools Dev 2.0, which enables interactive 3D development for CD-ROM or the web and a free Virtools Web Player 2.0

Virtools Dev 2.0 is composed of four elements: the Graphic User Interface, the Behavior Engine for the interactivity, the Rendering Engine for visualizing the applications and the SDK (Software Development Kit) to code proprietary behaviors, create executables and get low-level access to all features of the different engines.

Virtools Dev 2.0 has been shipping since mid-June. Special upgrades are available for Virtools V1.0.1 as well:

0134.5 Information Appliances

***Motorola Announces Alliance with Palm

(July 24)

Motorola's Semiconductor Products Sector, has announced its alliance with Palm to provide Palm OS licensees with the next generation of DragonBall microprocessors with ARM core-based technology. The alliance is part of Palm's Palm OS Ready Program.

Motorola's DragonBall MX1 offers the following features:

*  A low-power mobile multimedia client system-on-a-chip that is engineered for performance and long battery life.

*  A migration bridge between the 68K and ARM architecture due to reuse of the peripheral set.

*  Integrated Bluetooth baseband functionality to provide a seamless Bluetooth solution for PDA applications.

*  Shared peripheral sets that include an LCD controller that supports 16 gray-level monochrome, color STN displays and color TFT displays.

The DragonBall MX1 is targeted for information appliances, smart phones, Web browsers/tablets, digital media audio players, handheld computers based on the Palm OS platform, and mobile data/voice applications such as Motorola's wireless cellular products.

0134.6 Audio

***Pioneer's XM Satellite Tuners Available in September

(July 24)

Pioneer has announced pricing for its XM Satellite tuners that will be available at retail stores in September 2001. The tuners, which work with various Pioneer head units, will allow consumers to receive 100 digital channels of programming from XM Satellite Radio. Pioneer's line of satellite tuners include:

-- GEX-P900XM Add-On Tuner; MSRP: $199.

-- GEX-FM903XM Add-On FM Modulated Tuner; MSRP: $249. This tuner includes a small display and remote control. It can be connected to any existing mobile FM radio.

-- DEH-P3370XM Head Unit/Add-On Tuner Package; MSRP: $399. For consumers who want a completely new car stereo - includes a single CD head unit (DEH-P3300) and the add-on tuner.

Pioneer's XM tuners are compatible with 14 XM-ready head units introduced in 2001 and also can be used with most of the earlier Pioneer IP-Bus source units.

Find out more about satellites and XM Satellite’s system:

***Toshiba Microcontroller with SD Memory Card Controller

(July 23)

Toshiba has announced a microcontroller dedicated to supporting the SD memory card standard and the simplified design of high-capacity digital audio players. The 16-bit Complex Instruction Set Computer (CISC) incorporates an SD memory card controller that supports interfacing between an application platform and an SD memory card. It also integrates a Universal Serial Bus (USB) controller, enabling direct downloads to SD memory cards from PCs equipped with a USB port.

Integrated with either of Toshiba's TC94A02F, digital signal processor, the LSI enables configuration of a total solution for SD digital audio player design. Applications targeted by this solution include SD digital audio players offering copyright protection in line with the Secure Digital Music Initiative (SDMI) and reader-writers that download data from PCs to SD memory cards.

Samples of the new LSI will be available from the fourth quarter of 2001, at a sample price of US$20. Mass production will start in the first quarter of 2002.


 Part Number: TMP91CM26XB

 Package: Fine Ball Grid Array (FBGA)-144-pin

 Core: TLCS-900/ L1

 Operating Voltage: 3.0 - 3.6V

 Minimum Execution Time: 111 nanosecond (ns) (USB, 12Mbit/second)

 ROM: 32kbyte

 RAM: 16kbyte

0134.7 Standards

***Progress Made on IEEE 802.17 RPR Standard

(July 18)

The IEEE 802.17 Resilient Packet Ring (RPR) Working Group is on schedule to move to the draft stage in its standardization effort targeting the needs of carriers and service providers in metropolitan area networks (MANs), following its third plenary meeting. RPR Alliance and Working Group member companies agreed to work together, consolidating technology proposals prior to creating drafts this fall for the RPR industry standard for fiber optic networks used in MANs. Dozens of individual proposals are being refined and merged to reduce the number of drafts and to bring the proposed solutions closer together. The IEEE 802.17 Working Group will then forge a single solution for balloting next spring.

The RPR specification is being crafted so that metro networks can carry more data with greater reliability and efficiency and at lower cost. RPR will support carrier-class, service-level-agreement (SLA)-based metro Ethernet, IP, and legacy TDM services.

The drafts will provide details on the following 12 areas:

1) Resiliency and Protection,

2) RPR Frame Format,

3) Topology Discovery Mechanisms,

4) Physical Layer Reconciliation,

5) Bandwidth Management,

6) Operations, Administration, Maintenance, and Provisioning,

7) MAC Service Reference Models,

8) Aggregation,

9) Service Classes,

10) Bridging,

11) Layer Management, and

12) System Topology.

The IEEE 802.17 Working Group will next convene in San Jose, California, September 10 through 14.

Find out more about the IEEE and their standards efforts:



Copyright 2001 The WAVE Report

To subscribe to the WAVE Report go to

To unsubscribe also use the Wave Report Home page or send the preformatted UNSUBSCRIBE message:

List Management - Unsubscribe

Previous issues of WAVE, as well as other info can be found at

Comments on or questions about the WAVE may be sent to:

John N. Latta - Editor-In-Chief

The WAVE Report may be redistributed in full for individual readership and posted to newsgroups, Web, and FTP sites. This publication may not be reprinted or redistributed for profit. Short quotes are permitted but must be attributed to the WAVE Report.