*** SEMI Publishes 25 New Standards Related to Semiconductor, FPD
Manufacturing
(February 5)
SEMI has published 25 new technical standards applicable to the
semiconductor and flat panel display manufacturing industries.
The new standards are available for purchase in CD-ROM format or can be
downloaded from the SEMI website,
www.semi.org.
SEMI Standards are published three times a year. The new standards,
part of the February 2004 publication cycle, join more than 670
standards that have been published by SEMI during the past 30 years.
The standards released today include:
- SEMI D37 Specification for LCD Pellicles
- SEMI D38 Guidelines for Quality Area of LCD Masks
- SEMI E127.1 Provisional Specification for SECS-II Protocol for
Integrated Measurement Module Communications
- SEMI E131 Specification for the Physical Interface of an Integrated
Measurement Module onto 300 mm Using BOLTS-M
- SEMI E132 Specification for Equipment Client Authentication and
Authorization
- SEMI E133 Provisional Specification for Automated Process Control
Systems Interface
- SEMI M55.1 Standard for 50.8 mm Round Polished Monocrystalline 4H and
6H Silicon Carbide Wafers
- SEMI P41 Specification for Mask Defect Data Handling with XML,
Between Defect Inspection Tools, Repair Tools and Review Tools
- SEMI P42 Specification of Reticle Data for Automatic Reciprocal
Transfer to Wafer Exposure System
- SEMI P43 Photomask Qualification Terminology
- SEMI T12 Specification of Tracing Jigs and Implements
In addition to the above, 14 additional standards, designated F82
through F95 and related to mass flow controllers and mass flow meters,
were released during the February cycle.
www.semi.org
www.semi.org/standards
Wave Issue 0350 02/13/04 Article 1-03