Wave Issue 0306 3/7/03 Article 1-03

***VIA Acquires Wireless Communications Design Center in Sweden
(March 5)

VIA Technologies, Inc, a developer of silicon chip technologies
and PC platform solutions, today announced that it has acquired
the wireless applications design center co-established with
Swedish microelectronics institute Acreo in May 2001.

Located in Lund, Sweden, the VIA wireless design center is
dedicated to radio frequency (RF) technology design, adding
wireless system application R&D capabilities to VIA's silicon and
platform product portfolio.

Acreo is a Swedish research institute working with contract
research and development to provide microelectronics and optics
solutions. Its technological areas include Integrated Circuit
Design, Microelectronic Process Technologies, Optical Components
and Systems, Interconnect and Packaging Technologies, Robust
Electronics, Sensor Technologies, Visual Interfaces and SME
Services.

Acreo works in system-on-package (SoP) technology, and has added
strategic competence over the last few years in the area of
system-on-chip (SoC) design for wireless applications. Acreo has
facilities in Stockholm/Kista, Norrkoping, Lund and Hudiksvall in
Sweden. The department of System Level Integration is located in
Norrkoping and Lund.

VIA Technologies, Inc. is a developer of PC core logic chipsets,
microprocessors, and multimedia, communications, optical media
and networking chips. VIA products include VIA Apollo core logic
chipsets for the full range of PC platforms, and VIA C3
processors for value PCs and Internet appliances, as well as
developing solutions for the PC platform through its VPSD
Business Unit. Its customers include OEMs, mainboard
manufacturers, and system integrators. VIA is headquartered in
Taipei, Taiwan, with branch offices in the US, China and Europe.