***Samsung Ships Industry's First 256Mb SDRAM Made From 300mm
Wafers
(March 5)

Samsung Semiconductor, Inc., the world's leading manufacturer of
advanced memory technology, today announced that it has begun
volume shipment of the industry's first 256Mb Synchronous DRAM
(SDRAM), mass-produced from the company's 300mm wafer line in its
Hwasung, Korea manufacturing facility. Samsung's 300mm wafer fab
has been operational since last October when the company first
shipped 256Mb SDRAM samples to major computer manufacturers for
evaluation.

A 300mm wafer has two-and-a-half times the production capacity of
a 200mm wafer, enabling Samsung to manufacture 256Mb SDRAM in
volume quantities. Samsung's manufacturing capacity enables it to
apply a 0.15-micron design rule to its 300mm wafer production
line. Coupled with high yields, this enables the company to meet
the market demand for 256Mb SDRAM while remaining competitive in
price.

A growing need for increased desktop memory capacity will
continue to spur demand for high-speed 256Mb SDRAM. CPUs
operating at speeds of 2GHz and higher, high-speed graphics
applications, and Windows XP, require higher system memory
capacity. Samsung officials expect this increase in memory
requirement to spur demand for high-speed 256Mb SDRAM. Samsung
predicts a global demand of 800 million units in 2002.

Samsung plans to mass-produce 15 million units of 256Mb SDRAM on
its 300mm wafer line this year. In 2003, Samsung will mass-
produce 512Mb devices utilizing next-generation 0.10-micron
processing technology.

www.usa.samsungsemi.com


Wave Issue 0208 3/8/02 Article 6-02