Wave Issue 0206 2/22/02 Article 1-01

***Philips Semiconductors Produces World's First Dual-Mode
2.5G/3G RF Reference Design PCB
(February 18)

Philips Semiconductors, a division of Royal Philips Electronics,
today launches the world's first dual-mode RF reference design
for GSM/UMTS handsets, providing manufacturers with a complete RF
system for the test and evaluation of 2.5 and 3G mobile phones.

The new 48 x 26mm(2) single side Printed Circuit Board (PCB),
comparable in size to the current radios of single mode GSM
phones, will enable handset manufacturers to produce dual-mode,
GSM dual-band/WCDMA radio PCBs. The reference design is the first
on the market to include all of the RF components needed to build
a GSM/UMTS cellular handset suitable for WCDMA FDD modulation.
The integrated RF architecture also reduces the number of
external components optimizing the size and cost of the PCB.

The circuit board is designed around a complete 3G RF chipset
using the 0.25um QUBiC4 silicon process technology, and includes
the 3G Zero IF transmit and receive components the UAA3580 and
UAA3581, and Silicon Power Amplifier (PA) UAA3592.

The GSM part of the RF reference design is built around the 2.5G
Near Zero IF transceiver IC the UAA3536, providing clock
frequency to the 2.5 and 3G RF functionality, and 8x10 mm GaAs PA
module CGY2017 with its 4x4mm power controller IC UBA1711.

Samples of the complete RF reference design with radio chains for
both GSM and UMTS are now available for evaluation purposes, with
3G RF Chipset volume production scheduled for Q4 2002.

www.semiconductors.philips.com