Wave Issue 0200 1/4/02 Article 4-02

***Matrix Semiconductor Introduces 3D Semiconductor Products
(December 4)

Matrix Semiconductor recently disclosed technology for building
semiconductor products in three dimensions. The company claims
that by building semiconductor products in three dimensions, the
technology makes the best use of a semiconductor wafer's area and
achieves up to a tenfold cost reduction compared with existing
technologies. By building "up" as well as "out," Matrix believes
it can increase the number of bits per silicon wafer and design
chips for high-volume production at the lowest cost.

In addition, Matrix claims to achieve these benefits using the
standard materials, equipment, and processes already present and
understood in semiconductor manufacturing foundries. Matrix and
its technical team have been granted two U.S. patents covering
the inventions around 3-D semiconductor design and production,
and have filed over 60 additional applications.

The first product based on Matrix's technology will be Matrix 3-D
Memory, a semiconductor memory developed for use as a
"consumable," much like traditional camera film or audiotape. The
initial markets for this first product will include archival
storage for portable electronic devices such as digital cameras,
digital audio players, portable games, PDAs and cell phones. The
technology also demonstrates promise as a medium for pre-recorded
content, such as music, electronic books, games, digital maps,
and reference guides. Memory cards based on Matrix 3-D Memory
will be write-once, available in standard flash card form
factors, and interchangeable with standard flash cards.

www.matrixsemi.com/

Find additional information about 3D semiconductor technology:

www.wave-report.com/tutorials/3dsemi.htm