***Fab
TSMC Expands IP Offering with 0.25 Micron Library Components
(March 16)
Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) announced
that it has broadened its semiconductor intellectual property
library with the addition of memories, standard cells and I/O for
its 0.25-micron logic process. This step is part of TSMC's
overall IP initiative, which is designed to shorten customers'
product development cycles by facilitating the availability of a
wide range of process optimized, silicon verified IP components
and cores.
All the library components are optimized for TSMC's 0.25-micron
logic process to deliver performance, power, area, and
reliability. TSMC has contracted with Artisan Components to
create the memories and standard cells. These include Artisan
Component's 300MHz, Process-Perfect, HS300 single and dual-port
static RAM generators, and their Process-Perfect Standard Cell
Library with over 400 cells. The I/Os include over 150 cells for
2.5V and 3.3V I/O with 5V tolerance. These library elements are
available now from TSMC.
TSMC is a dedicated integrated circuit foundry and offers a
comprehensive set of IC fabrication processes, including
processes to manufacture CMOS logic, mixed-mode, volatile and
non-volatile memory, and BiCMOS chips. Currently, TSMC operates
two 6-inch wafer fabs (Fab 1 and 2), and three 8-inch wafer fabs
(Fab 3, 4 and 5), all located in Hsin-Chu, Taiwan. In July 1997,
TSMC broke ground on Fab 6, the first of TSMC's six fabs to be
located in Tainan, Taiwan. TSMC has subsidiaries in the US,
Europe and Japan. WaferTech, the company's U.S. joint venture fab
in Camas, Washington, will begin ramping to production in mid-
1998.
www.tsmc.com.tw
IDT Signs Foundry Agreement with IBM
(March 17)
Integrated Device Technology, Inc. (IDT) announced it has signed
a foundry agreement with IBM using their 0.25-micron, 2.5-volt
IBM Blue Logic technology to manufacture IDT WinChip C6+
microprocessors.
The three-year agreement, which also includes the production of
future generations of the IDT WinChip microprocessor, allows IDT
access to IBM's semiconductor manufacturing technology and
provides IDT with the additional capacity needed to meet demand
in the fast-growing, low-cost PC market.
IBM will use its 0.25-micron CMOS process technology to
manufacture the IDT WinChip processors at its eight-inch wafer
fabrication facility in Burlington, Vt.
The IDT WinChip C6+ processor has been designed with a highly
silicon-efficient architecture to reduce die size and lower power
consumption, making it an ideal solution for the sub-$1,000 PC
desktop and sub-$2,000 mobile PC market segments.
Wafer production for current and future IDT WinChip processors
will also be handled by IDT's manufacturing facilities in
Hillsboro, Ore. and San Jose, Calif. Both locations are in
production at 0.30-micron and are presently moving to 0.25-
micron.
www.winchip.com.
www.idt.com
Full Service Suppliers to Thrive in Custom Silicon Market Says
VLSI's Rich Beyer
(March 17)
New manufacturing and design technologies will transform the
custom silicon business into one of the most important segments
of the semiconductor industry in the early 21st century,
according to Rich Beyer, president and COO of VLSI Technology
Inc. Speaking at the "Silicon Strategies '98" conference, Beyer
said that multiple business models will emerge in the custom
silicon sector, with each model defined by who acts as "general
contractor" in the custom chip design and manufacturing process.
In this environment, full service custom silicon suppliers like
VLSI Technology will enjoy significant advantages in the
marketplace.
"The custom silicon question is no longer, 'How to design a
circuit?' but 'How to design the system?' Today's technologies
enable all of the elements of a complete electronic system-
microprocessor intelligence, logic, analog, memory, power
management-to be integrated on a single chip," said Beyer. "As
custom ICs form the main element of product design, the custom
circuit sector will grow faster than the electronics industry as
a whole, creating an exciting business environment for many new
and established players."
In his talk, Beyer analyzed the evolution of the system-on-a-chip
semiconductor industry from the 1980's to the early 21st century.
"Custom systems on a chip clearly represent the next wave of the
semiconductor industry in the early 21st century," commented
Beyer. "But achieving this destiny depends on the custom silicon
industry adapting new thinking and practices to make dramatic
progress in chip development productivity. Our job is to make it
simple, efficient and economical to design and manufacture even
the most complex custom IC products."
Beyer believes that as the custom silicon sector grows, multiple
business models are emerging to serve different classes of custom
silicon users. "I see at least three business models in the
custom silicon business. First we have the current ASIC model,
where the customer and IC supplier cooperate in chip design, and
the IC supplier handles all production responsibilities. Under
the second model, the customer may elect to contract out any or
all parts of the design and manufacturing to a series of design
houses, electronic design automation (EDA) tool companies,
intellectual property (IP) providers, contract fabs, test and
assembly houses, with the customer usually acting as 'general
contractor.' While this is the most 'open' business model, it
also adds complexity to an already complex undertaking." Beyer
believes a third model, based on the capabilities of established
full-service custom circuit suppliers like VLSI Technology, is
emerging as an important model in the custom IC industry. "In
this model, the customer partners with a full-service IC company.
The full-service supplier acts as 'general contractor,' offering
an optimized combination of design services, focused intellectual
property and high-flex manufacturing, along with integrated test,
packaging and assembly. We believe this model delivers an
advantageous combination of shorter time-to-market and more cost-
effective end products with the great virtue of a simplified
customer-vendor-technology relationship."
www.vlsi.com
Intel begins construction on its First 300mm Chip Development
Plant
(February 18)
Intel Corporation announced that it has begun construction on its
first 300-millimeter advanced logic wafer fabrication facility in
Hillsboro, Ore. It is here that Intel will first develop and
manufacture complex computer chips on 12-inch silicon wafers. The
new plant, part of a multiphase site development known as Ronler
Acres, will feature a 120,000 square-foot "Class 1" clean room
and will cost over $1.5 billion. The new wafer fabrication
facility will be the future home for Intel's Portland Technology
Development operation, which develops the manufacturing recipes
for future Intel chips. The plant will be used to develop
technologies of the 0.13-micron generation and beyond and will
eventually be converted into a volume-manufacturing factory.
www.intel.com
nVIDIA Forms Strategic Partnership With TSMC
(February 23)
nVIDIA Corporation announced it has formed a multi-year strategic
partnership with Taiwan Semiconductor Manufacturing Company
(TSMC). Headquartered in Hsin-Chu, Taiwan, TSMC will assist in
the manufacturing of all future nVIDIA products starting with the
latest offering, RIVA 128ZX. Effective immediately, TSMC will
provide nVIDIA with deep sub-micron process technology. This
multi-year strategic partnership expands capacity beyond the
agreement nVIDIA currently shares with fabrication partner SGS-
THOMSON.
www.nvidia.com
www.tsmc.com
Wave Issue 9806 4/10/98 Article 3-01